Advanced Packaging Market Report 2023 (Global Edition)

Global Advanced Packaging Market Report 2023 talks about crucial market insights with the help of segments and sub-segments analysis. In this section, we reveal an in-depth analysis of the key factors influencing Advanced Packaging Industry growth. Advanced Packaging market has been segmented with the help of its Type, Application Packaging Type , and others. Advanced Packaging market analysis helps to understand key industry segments, and their global, regional, and country-level insights. Furthermore, this analysis also provides information pertaining to segments that are going to be most lucrative in the near future and their expected growth rate and future market opportunities. The report also provides detailed insights into factors responsible for the positive or negative growth of each industry segment.

Report scope is customizable as we have a huge database of Advanced Packaging industry. We can deliver an exclusive report Edition/Consultation as per your data requirements. Request for your Free Sample Pages.

By Type, The Flip-Chip segment held a 34.68% share of the Advanced Packaging Market In 2021!

Based on the Type, the market is segmented into the flip chip, flip-chip, fan-in WLP, fan out, and 2.5D/3D. Flip chips held the largest market share in terms of type. A flip chip refers to the method of electrically connecting the die to the package carrier. The flip chip connection is generally formed one of two ways by using solder or using conductive adhesive.

• Flip Chip CSP
• Flip-Chip Ball Grid Array
• Wafer Level CSP
• 2.5D/3D
• Fan Out WLP
• Others

The above Chart is for representative purposes and does not depict actual sale statistics. Access/Request the quantitative data to understand the trends and dominating segment of Advanced Packaging Industry. Request a Free Sample PDF!

Application Segment Analysis of Advanced Packaging Market

This report forecasts revenue growth at the global, regional, and country levels and provides an analysis of the latest industry trends and opportunities for each application of Advanced Packaging from 2018 to 2030. This will also help to analyze the demand for Advanced Packaging across different end-use industries. Our research team will also help acquire additional data such as Value Chain, Patent analysis, Company Evaluation Quadrant (Matrix), and much more confidential analysis and data insights.

Some of the key Application of Advanced Packaging are:

• Packaged Food
• Frozen Processed Food
• Chilled Processed Food
• Dried Processed Food
• Packaged Beverages

The above Graph is for representation purposes only. This chart does not depict actual Market share. Please purchase the Advanced Packaging market report 2023 Edition by contacting our team.

Advanced Packaging Packaging Type Segment Analysis

• Controlled Packaging
• Active Packaging
• Intelligent Packaging
• Advanced Packaging Components

Advanced Packaging Industry Vertical Segment Analysis

By Industry Vertical, Consumer Electronics segment accounted for 37.98% share of the total Advanced Packaging Market in 2021!

Based on the Industry Vertical, the market is segmented into consumer electronics, automotive, aerospace & defense, healthcare, and others. Consumer electronics is dominating the segment in terms of industry verticals on account that the consumer electronics industry is growing at a rapid pace. Consumer electronics manufacturers need powerful and connected packaging solutions to improve their brand image. And it’s also vital to consider the sustainability of the packaging.

• Consumer Electronics
• Automotive
• Industrial
• Healthcare
• Aerospace & Defense
• Others

Asia Pacific Advanced Packaging Market Dominates the overall market!

Geographically, the market is divided into regions including North America, Europe, Asia Pacific, Latin America, and Middle-east Countries.
Asia Pacific is expected to account for a considerable revenue share in the advanced packaging market during the forecast period, 2022-2029. It is attributed to the government in Asian countries increasingly building the overall semiconductor ecosystem and ensuring that it rapidly expands the electronics manufacturing and innovation ecosystem. For example, the Semiconductor Industry Association (SIA) reported that nearly 76.19% of the global installed capacity is concentrated in East Asia including Japan, South Korea, Taiwan, and mainland China. Besides, major China-based technology companies like Alibaba, Baidu, and Oppo also announced plans to develop their own chips. 
North America is growing at the highest CAGR during the forecast period in the growth of the advanced packaging market. This is due to the higher investments in new semiconductor factories for manufacturing expansion and the emergence of new wafer-packing technologies in the region. 

Region-wise, the market is analyzed across: (In case you wish to acquire a specific region or any country data then please contact us)

• North America (United States, Canada, Mexico)
• Europe (United Kingdom, France, Germany, Italy, Russia, Spain, Sweden, Denmark, Netherlands, Switzerland, Belgium)
• Asia-Pacific (China, Japan, Korea, India, Australia, Philippines, Singapore, Malaysia, Thailand, Indonesia, Rest of APAC)
• South America (Brazil, Argentina, Colombia, Peru, Chile, Rest of South America)
• Middle East and Africa (Saudi Arabia, Turkey, Nigeria, UAE, Egypt, South Africa, GCC Countries, Rest of MEA)

The above graph is for illustrative purposes only. To learn more about geographical trends request the free sample pages. Contact US!

Advanced Packaging Industry News:

• Amkor Technology Announced Plan to Expand Advanced Packaging Technology Capacity with New Factory in Vietnam 

In November 2021, the company has announced that it planned to build a state-of-the-art smart factory in Vietnam. The first phase of the new factory focused on providing advanced system-in-package (SiP) assembly and test solutions to the world’s top semiconductor and electronic manufacturing companies. This expansion is important for long-term investment in geographical diversification and factory capacity expansion which will gain the company’s loyalty in regard to reliable supply chain solutions for its customers. 

• Intel detailed new chip packaging design 

In August 2022; Intel released information about its new tile-based chip packaging design at Hot Chips. The new design has been used in Intel’s upcoming Meteor Lake, Arrow Lake, and Lunar Lake processors. Chiplet-based CPUs have a modular design that incorporates multiple smaller dies to create a single CPU package. Advanced packaging technologies such as Intel’s EMIB and Foveros usher in a new era in chipmaking expanding its functional capabilities. 

Top Companies Market Share in Advanced Packaging Industry: (In no particular order of Rank)

• Amkor Technology Inc.
• Taiwan Semiconductor Manufacturing Company Limited
• Advanced Semiconductor Engineering Inc.
• Intel Corporation
• STATS ChipPAC Pte. Ltd
• Chipbond Technology Corporation
• Samsung Electronics Co. Ltd
• Universal Instruments Corporation
• Brewer Science Inc.
• Confidential Data
• Access The Paid Version
• Data Hidden

*List of Second Tier Companies, List of Third Tier/ Start-up Companies (Inquire with sales executive) Request Any Company Profile for Preview Purpose OR Data Validation!

If any Company(ies) of your interest has/have not been disclosed in the above list then please let us know the same so that we will check the data availability in our database and provide you the confirmation or include it in the final deliverables..