Competitive Analysis Of Development Boards Market: Cognitive Market Research

Sr. No.

Item

Description

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Company Name

AT&S Austria Technology & System Technology Aktiengesellschaft

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Website

ats.net

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Established Date

1987

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Headquartered

Austria

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Market Position/ History

AT&S Austria Technology & System Technology Aktiengesellschaft was founded in 1987 and is based in Leoben, Austria.

In 1999, the company completed the acquisition of Indal Electronics Ltd., the largest Indian PCB factory, in Nanjangud and is now known as AT&S India Private Limited.

In 2001, it expanded to China for HDI manufacturing and in 2006, it acquired the Korean printed circuit board manufacturer Tofic Co. Ltd.

In the course of time, the company expanded its production sites across India, China and Austria. In 2013, AT&S entered the IC substrate segment.

Further, in 2016, AT&S started a series production of IC substrates at its Chongqing facility.

Recently, in 2021, opened new factory in Kulim, Malaysia.

The company has 6 production sites in Europe and Asia. The plants in Austria, India, and Korea focus on small and medium-sized series for the industrial and automotive sectors. Large series are manufactured in China and Malaysia for customers in the areas of IC substrates and mobile devices.

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Sales Area

Worldwide

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Manufacturing Location

Austria (Leoben and Fehring), Korea (Ansan), India (Nanjangud), China (Shanghai and Chongqing), and Malaysia (Kulim)

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Ticker

ATS:VIE

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No. of Employees

Around 15,000 employees worldwide

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Competitors

TTM Technologies, Chin-Poon Industrial, Sumitronics, Hangzhou Lion Microelectronics

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CEO

Andreas Gerstenmayer

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Ownership Type

Public

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Sales Volume

10 to 12 Million Units

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Contact Information

Fabriksgasse 13, 8700 Leoben, Austria

Tel: +43 3842 200-0

Product

Product Description

ECP (Embedded Component Packaging) Printed Circuit Boards

Its printed circuit boards with ECP technology are the culmination of years of development work in the field of miniaturization. By “burying” components within a circuit board, the company creates a third functional level: valuable space is now also available for components inside the circuit board, instead of just on the top and bottom. This allows such a board to fulfill many more functions than a conventional board of the same size. Its ECP printed circuit boards are used in high-tech applications ranging from medical technology to consumer electronics.

• ECP printed circuit boards enable more compact systems and smaller devices.
• Moving components inside the printed circuit board affords them better protection while freeing up room on the outer layers.

ECP-printed circuit boards are important within diverse areas of the electronics industry. Their thin design makes them suitable for use in ultra-thin smartphones and tablets. Tiny communication modules can also be enclosed in smart pens and other unusual form factors that open up new possibilities in consumer electronics.

Speaking of smartphones, these small circuit boards enable a larger, longer-lasting battery. Chargers with ECP technology enable these batteries to charge more quickly. Electronic access controls, data centres, smart factories, and medical technology all benefit from the reduced system size and enhanced reliability of these PCBs.

Specifications:

• Layer count: 4 to 12 layers
• Embedded core layer count: 2 or 4 layers
• Copper nominal thickness: RCC: 12 to 22 µm
• PP: 12 to 35 µm
• Die to package ratio: >35%
• Component thickness: 60 to 300 µm

High-frequency & high-speed printed circuit boards

The interconnected nature of everyday life requires the transmission of large amounts of data – just think of streaming a video or using an app. Mobile networks and other wireless data transmission infrastructure require high-frequency signals to do this. However, this entails a number of problems. The higher the frequency, the higher the losses during transmission, which in turn leads to higher energy consumption. So electronic systems that process high-frequency signals need the shortest possible conducting paths to function efficiently.

• Allows antennae and signal processing to be integrated in a complete package.
• The compact design ensures shorter signal pathways.
• Low losses during signal transmission and processing.

Multilayer printed circuit boards

Multilayer printed circuit boards are AT&S’s core business and form the basis for most technologies used for further miniaturizing electronic circuits and systems. At the dawn of modern electronics, printed circuit boards were simple resin-bonded paper with circuits printed on one side. But technology soon developed in response to increasing demands for integrating and miniaturizing electronics.

• Multilayer printed circuit boards ensure short and fast signalling pathways.
• The layered structure allows for complex circuits.
• The compact design enables further miniaturisation of circuits and devices.

Flexible and rigid-flex printed circuit boards

Technological innovation of the kind we’re seeing in the medical sector or the automotive industry is mainly driven by the miniaturization of electronic circuits. These days, a great many modern hearing aids, medical implants and LED car headlights make exacting demands of printed circuit boards, and require them to be installed in tiny spaces. AT&S can easily meet these demands by using flexible base materials. Flexible printed circuit boards can be bent or twisted during assembly, so they can be integrated into devices with almost any form factor and with space constraints. This is extremely important in devices like hearing aids and pacemakers.

Substrate-like printed circuit boards and modules

Demands on the digital devices company use in everyday life are increasing year upon year. The smartphones that company carry around with us all the time are a good example. In the early days of mobile phones, client needed a large device to make calls on the go. This development comes down to the remarkable miniaturisation of technology, which required more and more components to be combined and integrated into a single housing.

Modules and substrate-like printed circuit boards are the crowning glory of these efforts so far. Circuits on substrate-like printed circuit boards are significantly smaller than anything previously possible within the circuit board industry, while modules enable the dense packaging of electronic systems. Processes from the production of IC substrates have to be used to apply such tiny structures to printed circuit boards and modules. Its processes are gradually getting us closer to the nano realm of the semiconductor industry.

• Very small substrate-like printed circuit boards can significantly reduce system size.
• Modularisation can reduce production costs for device manufacturers.
• Modules can be integrated into systems just as easily as any other components.
• Manufacturers can reduce the time to market by creating systems out of pre-built components.

HDI printed circuit boards

In printed circuit board manufacturing, “HDI” stands for “high density interconnect”. HDI-printed circuit boards have played an important role in the history of AT&S; indeed, they marked the beginning of the company’s rise to become the market leader in the manufacture of high-end PCBs. The high circuit density and small structures enable tiny form factors for devices like mobile phones and digital cameras and make the process of controlling engines and other complex systems efficient.

• Higher circuit density enables a high degree of miniaturization.
• Short and fast connections mean high data rates.
• The compact design keeps line lengths and losses to a minimum.
• HDI technology can be combined with other AT&S processes to create highly adaptable printed circuit boards.
• Eco-friendly materials without halogens can be used during production.

Year

Latest News

January 22, 2024

AT&S announced to opening of its first factory in Malaysia

In January 2024, it will open its new factory in Malaysia. AT&S's new factory in Kulim produces IC substrates for the next generation of microchips for high-performance computing, data centers and AI applications from leading manufacturers such as AMD.