Dicing Machines Market Report 2025 (Global Edition)

Global Dicing Machines Market Report 2025 Market Size Split by Dicing Technology (Blade Dicing, Laser Ablation, Plasma Dicing), by Application (Logic & Memory, MEMS Devices, Power Devices, CMOS Image ...

Dicing Machines Market Report Description

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Dicing Machines Market Insights Video

Competitive Landscape aof Dicing Machines

There are several significant competitors in the competitive market for dicing equipment. These rivals, who command a sizeable market share, are focusing on expanding their clientele abroad. They use advances to boost their profitability, market share, and recognition.

January 2022: With the introduction of dicing technology, Corning's laser technology division intensified its attention on microfabrication procedures for semiconductor use. According to the business, the new technique would enable clients to save costs through increased throughput and achieve decreased kerf loss and high edge strength through an intrinsically clean process to do away with additional cleaning stages.

(Source:www.corning.com/worldwide/en/the-progress-report/crystal-clear/cornings-vital-role-in-driving-the-future-of-semiconductor-chip-production)

October 2021: In order to increase its presence in the market for defense microelectronics systems, Northrop Grumman, a provider of dicing, backend wafer post-processing capabilities, soldier bumping, passivation, and advanced inspection and test solutions, established a wafer post-processing and test source specifically for defense applications.

(Source:www.northropgrumman.com/what-we-do/microelectronics)

Top Companies Market Share in Dicing Machines Industry: (In no particular order of Rank)

• Suzhou Delphi Laser Co. Ltd
• SPTS Technologies Limited (KLA Tencor Corporation)
• ASM Laser Separation International (ALSI) BV
• Tokyo Seimitsu Co. Ltd
• Neon Tech Co. Ltd
• Nippon Pulse Motor Taiwan (NPM) Group
• Panasonic Corporation
• Plasma-Therm LLC
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*List of Second Tier Companies, List of Third Tier/ Start-up Companies (Inquire with sales executive) Request Any Company Profile for Preview Purpose OR Data Validation!

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In terms of revenue, Asia Pacific Dicing Machines Market share was 37.5% of total market

According to Cognitive Market Research, Asia Pacific dominated the market in 2023 and accounted for a share of more than 37.5% of the global revenue due to several variables. The Asia Pacific region dominates the market for dicing machines. The semiconductor industry has experienced remarkable expansion over the past few decades, with nations like China and Taiwan emerging as the top producers of semiconductors. Among the leading producers of semiconductor chips in the area are TSMC, Samsung, SK Hynix, and others.

The North American region's strong economy and significant presence of multinational firms create a considerable demand for dicing machines, which promotes global trade and business growth. One of the semiconductor markets with the strongest growth rates worldwide is the U.S. Because there is such a huge demand for smartphones and other consumer electronics products, several vendors are developing production sites all throughout the country.

The current report Scope analyzes Dicing Machines Market on 5 major region Split (In case you wish to acquire a specific region edition (more granular data) or any country Edition data then please write us on info@cognitivemarketresearch.com

• North America (United States, Canada, Mexico)
• Europe (United Kingdom, France, Germany, Italy, Russia, Spain, Sweden, Denmark, Switzerland, Luxembourg, Rest of Europe)
• Asia Pacific (China, Japan, South Korea, India, Australia, Singapore, Taiwan, South East Asia, Rest of APAC)
• Latin America (Brazil, Argentina, Colombia, Peru, Chile, Rest of South America)
• Middle East (Saudi Arabia, Turkey, UAE, Egypt, Qatar, Rest of Middle East)
• Africa (Nigeria, South Africa, Rest of Africa)

The above graph is for illustrative purposes only.

Dicing Machines Market Analysis

Dicing Technology Segment Analysis

According to Cognitive Market Research, blade dicing is the item that is utilized the most frequently in the market for dicing machines. Wafer dicing is the process of separating individual silicon chips (die) from one another. During the dicing procedure (scribe lines or dicing streets), the surplus gaps between the dies are mechanically sawed out of the wafer. It is now possible to cut silicon wafers with a diameter of 200mm or 300mm and 0.05mm square cuts. The industrial diamond is concealed in the resin by the standard using a diamond blade. Depending on the subject material, the blade thickness varies from 20 m to 35 m while cutting silicon wafers. The wafer dicing process control and precision skills are essential. The yield and productivity of the entire process are determined by the pace at which the wafer substrate is fed into the cutting blade. Therefore, most businesses require high-speed, high-cutting dicing machines, which can boost throughput rate and cut costs. Diamond blades are frequently used in dicing machines, and these devices need a continual coolant flow. This is the only way to get a uniform cut quality. Uncontrollable factors can lead to deviations, including nozzle clogging, adjustment adjustments, and blade quality. Therefore, it is necessary to monitor blade torque using a statistical method continuously. Online dicing machine performance monitoring is essential for ensuring process stability.

Laser ablation is the second-most used product. While blade dicing rules the market, Laser ablation is still necessary for some dicing machines. The market for laser ablation dicing machines is expanding due to the rising need for semiconductor technology. Smartphones, laptops, and automobiles are just a few of the many applications for semiconductor devices. The market for laser ablation dicing machines is anticipated to expand due to the rising demand for these devices in the next years.

• Blade Dicing
• Laser Ablation
• Plasma Dicing

The above Chart is for representative purposes and does not depict actual sale statistics. Access/Request the quantitative data to understand the trends and dominating segment of Dicing Machines Industry. Request a Free Sample PDF!

Application Segment Analysis

The MEMS devices are the dicing machines market's most popular offering. One of the key drivers of the expansion of the MEMS segment in the Thin wafer processing and dicing equipment market is the growing popularity of IoT in semiconductors, as well as the rising demand for smart consumer electronics and wearable devices. High precision in wafer production is required due to the tendency towards miniaturization in semiconductors and electronics, creating market expansion prospects. TDK Corporation introduced the T5828 SoundWire MEMS microphone in January 2022 as a component of the SmartSound performance products for mobile, IoT, TWS, and other consumer electronics. These advances expand the Thin wafer processing and dicing equipment market and benefit the MEMS industry.

According to Cognitive Market Research, power devices are the second-most popular product. Power device dicing equipment is often a high-precision device that can slice wafers into incredibly thin slices. To make the cuts, they frequently have water jets or lasers. The particular application and the needs of the power source will determine which dicing machine is best.

• Logic & Memory
• MEMS Devices
• Power Devices
• CMOS Image Sensor
• RFID

The above Graph is for representation purposes only. This chart does not depict actual Market share.

Author's Detail

Aarti Bagekari

Research Associate at Cognitive Market Research

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I am Aarti Bagekari, worked as a research associate with strong passion for transforming complex information into strategic insights. My strong analytical skills, coupled with a deep understanding of market dynamics and consumer behavior, empower me to identify hidden opportunities and proactively mitigate risks for clients. As a part of team, I possess a skills in data analysis, segmentation, competitive landscape.

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